move thermal makefile to the dump folder. This is done as a part of
reorganizing thermal sepolicy code.
Reland this change, since all the references from EoL socs are removed.
Bug: 289146743
Test: Compilation and bootup test
Change-Id: Ibe60672d34b02712f04293cc891c12a07a93c23e
Signed-off-by: Ram Chandrasekar <rchandrasekar@google.com>
move thermal makefile to the dump folder. This is done as a part of
reorganizing thermal sepolicy code.
Bug: 289146743
Test: Compilation and bootup test
Change-Id: I43d5d3916e7ec49cfc174bf709a466d4078b1c21
Signed-off-by: Ram Chandrasekar <rchandrasekar@google.com>
Add all thermal HAL sepolicy and makefile to the new common folder.
Bug: 289146743
Test: Compilation test
Change-Id: I133dcdac20a970e7ff4026fa503e46fd073be34f
Signed-off-by: Ram Chandrasekar <rchandrasekar@google.com>
Reorganize the dump thermal script source and sepolicy to its own
folder. This is done as a part of moving all thermal product
makefiles to gs-common.
Bug: 289146743
Test: Compilation and bootup test
Change-Id: Ie9162b401c9bed57c3d2e2648edc17457ad8883e
Signed-off-by: Ram Chandrasekar <rchandrasekar@google.com>
- use echo instead of printf to save script execution time
- fix incorrect format in dump_thermal.sh
Bug: 290888701
Test: time ./dump_thermal.sh
Test: adb bugreport
Change-Id: I501775ccceaf9dc423db87913939ea2e361ed8c7
At the bugreport, capture Temperature Residency metrics
Bug: 246799997
Test: Test: "adb bugreport" includes temp residency metrics capture.
Change-Id: I1cb1c9e53890f3175812e15a15f09bcb7fd9d6af